On July 17, Huike Co., Ltd. (001399.SZ) announced that on July 17, 2026, it signed the "Advanced Packaging and Testing Project Cooperation Agreement" with the Management Committee of the Shaoxing Area of the Hangzhou-Shaoxing Integrated Economic Development Demonstration Zone to carry out the Huike Advanced Packaging and Testing Project. The company plans to invest 4 billion yuan to establish a wholly-owned subsidiary, Zhejiang Huixin Advanced Semiconductor Co., Ltd., which will serve as the implementation entity for the project. The project will be constructed in two phases, with the first phase planned for advanced packaging and testing of 12-inch mixed chips, achieving a production capacity of 20 million units per month upon reaching full capacity, with a construction period not exceeding three years. In the context of the global semiconductor industry supply chain restructuring and the continuous growth of domestic chip packaging and testing market demand, this investment allows the company to enter the advanced packaging and testing field, representing a significant initiative for the company to extend into high-value-added segments of the industry chain. This move is expected to foster new business growth, optimize the industrial structure, and enhance the company's overall competitiveness and long-term profitability.
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