According to a report from ZDNet Korea on October 20, AI chip company Groq, which has been effectively acquired by NVIDIA, is advancing the introduction of 3D stacked DRAM packaging in its next-generation chips to replace the faster but lower-capacity SRAM solutions. Groq was founded in 2016 by former Google TPU designer Jonathan Ross, and it was reported that the company was acquired by NVIDIA through indirect means last year. The solution being evaluated by Groq is 3DS, a high-capacity packaging method that connects DRAM chips vertically through silicon vias. 3D packaging allows multiple bare chips to be stacked vertically and function as a single chip, reducing area and improving power efficiency compared to planar solutions. Both 3DS and HBM use silicon vias, but HBM focuses on transmission speed, while 3DS maintains existing DRAM interfaces and emphasizes capacity expansion. An anonymous industry insider stated that Groq plans to use 3D packaging in its next-generation chips, stacking DRAM rather than SRAM; another source mentioned that market demand is shifting towards larger capacity chips, prompting Groq to choose DRAM, which has a competitive advantage in capacity.