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Prominent US Stock KOL: CPO Currently Faces Severe Capacity Bottlenecks and Yield Issues

On June 10, US stock KOL Herman Jin (@ShanghaoJin) responded on social media to the statement that 'only Intel's (INTC) EMIB packaging technology can truly achieve CPO (Co-Packaged Optics), while TSMC's (Taiwan Semiconductor Manufacturing Company) CoWoS technology cannot.' He stated, 'CPO currently faces severe capacity bottlenecks and too many yield (production) issues. Everyone should calm down and not be overly optimistic.'

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