On April 28, according to the Taiwan Commercial Times, TSMC Senior Vice President Hou Yongqing stated that in response to the explosive demand for AI and high-performance computing (HPC), TSMC is accelerating its expansion plans at 'double speed'. This year, five 2nm wafer fabs will simultaneously enter the capacity ramp-up phase, marking the most aggressive expansion record in the company's history. As a result, the first-year output of 2nm will increase by approximately 45% compared to the same period for 3nm. (Dongxin News Agency)
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