On April 29, South Korean media outlet The Elec reported that Professor Joo Seung-hwan from Inha University revealed at an advanced packaging technology conference in Seoul that an analysis of patents suggests Dutch lithography giant ASML may be leveraging its flagship lithography platform, Twinscan, to develop wafer-to-wafer (W2W) hybrid bonding equipment. The Twinscan platform significantly enhances manufacturing efficiency with its dual wafer stage design, and if this technology is transferred to W2W hybrid bonding equipment, it is expected to substantially shorten the production cycle for direct bonding of two wafers. This latest development indicates that ASML is attempting to extend its dominance in the lithography field into the packaging segment. (Dongxin News Agency)
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ASML Developing Wafer-to-Wafer Hybrid Bonding Equipment to Shorten Production Cycle
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